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Inventor profile of:

Wei Feng Qu

City:

Country:

United States

Published Applications:

1

Last publication date:

2013-12-26

Top Assignees for applications by Wei Feng Qu

The entities that hold a legal rights for patent applications filed by inventor Qu Wei Feng:

SHIN-ETSU HANDOTAI CO., LTD. 1 Tokyo, Japan

Recent patent applications by Qu Wei Feng

Wei Feng Qu from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-12-26

US20130341763A1

Bonded substrate and manufacturing method thereof

InventorID:

583181 ⎘