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Inventor profile of:

Jun Wang

City:

Chicago, Illinois

Country:

United States

Published Applications:

1

Last publication date:

2023-09-07

Recent patent applications by Wang Jun

Jun Wang from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-09-07

US20230279197A1

Chemistry; metallurgy

MECHANICALLY ADAPTIVE MATERIALS

InventorID:

5842103 ⎘