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Inventor profile of:

Jun He

City:

Zhubei

Country:

Taiwan

Published Applications:

8

Last publication date:

2026-06-25

Top Assignees for applications by Jun He

The entities that hold a legal rights for patent applications filed by inventor He Jun:

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 4 Hsinchu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 2 Hsinchu, Taiwan

Recent patent applications by He Jun

Jun He from Zhubei, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-25
US20260182423A1
Electricity

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

#2 | 2025-08-21
US20250266380A1
Electricity

HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS

#3 | 2024-11-07
US20240371780A1
Electricity

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

#4 | 2024-08-01
US20240258263A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

#5 | 2024-02-01
US20240038682A1
Electricity

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

#6 | 2023-09-14
US20230290747A1
Electricity

Heat dissipating features for laser drilling process

#7 | 2023-06-08
US20230178475A1
Electricity

DELAMINATION CONTROL OF DIELECTRIC LAYERS OF INTEGRATED CIRCUIT CHIPS

#8 | 2023-02-09
US20230045422A1
Electricity

Semiconductor package and method of forming same

InventorID:

5851084 ⎘

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