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Inventor profile of:

Xiaorui Yang

City:

Shanghai

Country:

China

Published Applications:

2

Last publication date:

2025-02-06

Recent patent applications by Yang Xiaorui

Xiaorui Yang from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-02-06

US20250046693A1

CHIP PACKAGING STRUCTURE, PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF

#2 | 2023-09-21

US20230298978A1

Package, Lead Frame and Roughening Method Thereof

InventorID:

5857701 ⎘