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Inventor profile of:

Craig S. Mitchell

City:

San Jose, California

Country:

United States

Published Applications:

26

Last publication date:

2016-02-04

Top Assignees for applications by Craig S. Mitchell

The entities that hold a legal rights for patent applications filed by inventor Mitchell Craig S.:

Recent patent applications by Mitchell Craig S.

Craig S. Mitchell from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-02-04
US20160035692A1
Electricity

Stacked packaging improvements

 #2 | 2015-04-16
US20150102508A1
Electricity

Stacked packaging improvements

 #3 | 2013-12-26
US20130344682A1
Electricity

Stacked packaging improvements

 #4 | 2012-09-27
US20120241960A1
Electricity

Substrate for a microelectronic package and method of fabricating thereof

 #5 | 2012-03-08
US20120056324A1
Electricity

SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF

 #6 | 2011-02-24
US20110042810A1
Electricity

Stacked packaging improvements

 #7 | 2010-10-28
US20100273293A1
Electricity

Substrate for a microelectronic package and method of fabricating thereof

 #8 | 2009-04-23
US20090104736A1
Electricity

Stacked packaging improvements

 #9 | 2009-03-19
US20090071707A1
Electricity

Multilayer substrate with interconnection vias and method of manufacturing the same

 #10 | 2007-10-11
US20070235856A1
Electricity

Substrate for a microelectronic package and method of fabricating thereof

 #11 | 2007-06-28
US20070148819A1
Electricity

Microelectronic assemblies having very fine pitch stacking

 #12 | 2007-06-28
US20070145550A1
Electricity

Microelectronic elements with compliant terminal mountings and methods for making the same

 #13 | 2007-05-10
US20070105282A1
Electricity

Micro lead frame packages and methods of manufacturing the same

 #14 | 2007-05-03
US20070096311A1
Electricity

Structure and method of making capped chips having vertical interconnects

 #15 | 2007-05-03
US20070096295A1
Electricity

Back-face and edge interconnects for lidded package

 #16 | 2006-05-11
US20060099789A1
Electricity

Micro lead frame packages and methods of manufacturing the same

 #17 | 2006-03-09
US20060049498A1
Electricity

Methods of making microelectronic assemblies including compliant interfaces

 #18 | 2006-02-16
US20060033216A1
Electricity

Stacked packages

 #19 | 2005-12-22
US20050279916A1
Electricity

Image sensor package and fabrication method

 #20 | 2005-12-20
US10454029
-

Stacked packages

 #21 | 2005-08-11
US20050173796A1
Electricity

Microelectronic assembly having array including passive elements and interconnects

 #22 | 2005-07-05
US10834342
-

Stacked packages

 #23 | 2005-05-24
US10267450
-

Stacked packages

 #24 | 2005-05-05
US20050095835A1
Electricity

Structure and method of making capped chips having vertical interconnects

 #25 | 2005-04-28
US20050087861A1
Electricity

Back-face and edge interconnects for lidded package

 #26 | 2005-04-26
US10044121
-

Stacked microelectronic assemblies and methods of making same
InventorID:

587018 ⎘