Yuchi YANG

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2024-08-08

Top Assignees for applications by Yuchi YANG

The entities that hold a legal rights for patent applications filed by inventor YANG Yuchi:

Yuchi YANG from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

LEAD BONDING STRUCTURE COMPRISING EMBEDDED MANIFOLD TYPE MICRO-CHANNEL AND PREPARATION METHOD FOR LEAD BONDING STRUCTURE

SILICON-BASED FAN OUT PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR

InventorID:

5872135 ⎘