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Inventor profile of:

Eiichi TABEI

City:

Annaka

Country:

Japan

Published Applications:

Last publication date:

2018-11-01

Top Assignees for applications by Eiichi TABEI

The entities that hold a legal rights for patent applications filed by inventor TABEI Eiichi:

SHIN-ETSU CHEMICAL CO., LTD 12 Tokyo, Japan
Shin-Etsu Chemical Co., Ltd. 3 Chiyoda-ku, Japan

Recent patent applications by TABEI Eiichi

Eiichi TABEI from Annaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-11-01

US20180315906A1

Electricity

Addition curable type silicone resin composition, process for producing composition, and optical semiconductor apparatus

#2 | 2016-11-10

US20160326340A1

Chemistry; metallurgy

Organic modified silicone resin composition

#3 | 2016-09-01

US20160251555A1

Chemistry; metallurgy

SILICONE ADHESIVE

#4 | 2013-12-26

US20130345359A1

Electricity

Curable resin composition, hardened material thereof, and optical semiconductor apparatus

#5 | 2008-11-13

US20080281056A1

Chemistry; metallurgy

Curable organosilicon composition and cured product thereof

#6 | 2007-05-10

US20070104872A1

Chemistry; metallurgy

Method of sealing semiconductor element mounted on gold-plated printed circuit board

#7 | 2006-07-20

US20060159937A1

Electricity

Silicone-sealed LED

#8 | 2006-03-28

US10829282

Curable silicone resin composition

#9 | 2005-09-29

US20050213926A1

Electricity

Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device

#10 | 2005-04-14

US20050080154A1

Chemistry; metallurgy

Curable composition

#11 | 2005-03-24

US20050061437A1

Physics

Curable silicone resin composition

#12 | 2005-02-17

US20050038221A1

Chemistry; metallurgy

Curable silicone resin composition

InventorID:

588033 ⎘