HSINCHU COUNTY
Taiwan
16
2025-11-20
The entities that hold a legal rights for patent applications filed by inventor HE JUN:
JUN HE from HSINCHU COUNTY, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES
#2 | 2025-11-20Integrated Circuit Package Structure with Thermelectric Self-Cooling Device
#3 | 2025-11-20MULTIZONE THERMAL DEVICE FOR SEMICONDUCTOR STRUCTURES
#4 | 2025-11-20Semiconductor Device Package with Thermal Module
#5 | 2025-11-13HEAT SINK STRUCTURE AND METHODS THEREOF
#6 | 2025-10-02SPACER FRAME FOR GRAPHITE THERMAL INTERFACE MATERIALS
#7 | 2025-07-31MULTIZONE THERMAL DEVICE FOR SEMICONDUCTOR STRUCTURES
#8 | 2025-07-10HEAT SINK STRUCTURE AND METHODS THEREOF
#9 | 2025-07-03Integrated Circuit Package Structure with Thermelectric Self-Cooling Device
#10 | 2025-04-24SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES
#11 | 2024-11-28Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
#12 | 2024-11-28THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
#13 | 2024-11-28DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
#14 | 2024-06-27PACKAGE COMPONENT
#15 | 2023-12-14Dicing method for stacked semiconductor devices
#16 | 2023-10-26Package component and forming method thereof
5892640 ⎘