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Inventor profile of:

Jack Yang

City:

Taichung

Country:

Taiwan

Published Applications:

2

Last publication date:

2023-10-26

Recent patent applications by Yang Jack

Jack Yang from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-10-26

US20230345633A1

PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS

#2 | 2018-05-31

US20180147741A1

Performing operations; transporting

Handheld mortise forming device

InventorID:

5892651 ⎘