Ladera Ranch, California
United States
13
2025-09-04
The entities that hold a legal rights for patent applications filed by inventor Karikalan Sam:
Sam Karikalan from Ladera Ranch, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Multilayer Cores, Variable Width Vias, and Offset Vias
#2 | 2025-03-20CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH-SPEED SIGNALS
#3 | 2024-05-09Photonics Integration in Semiconductor Packages
#4 | 2024-02-01Integrated Antennas on Side Wall of 3D Stacked Die
#5 | 2024-02-01Semiconductor Package with Side Wall Interconnection
#6 | 2024-02-01Semiconductor Package Interconnection Structure
#7 | 2024-02-01Elastomer Interconnection Substrate Layer
#8 | 2024-02-01Edge Seal for Bonded Stacks of Different Size Semiconductor Devices
#9 | 2023-12-07Mixed Dielectric Materials for Improving Signal Integrity of Integrated Electronics Packages
#10 | 2023-11-163D Packaging Heterogeneous Area Array Interconnections
#11 | 2023-11-16Cantilevered power planes to provide a return current path for high-speed signals
#12 | 2023-11-16Photonics integration in semiconductor packages
#13 | 2023-11-02Multilayer Cores, Variable Width Vias, and Offset Vias
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