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Inventor profile of:

Michael Milo

City:

Baguio City

Country:

Philippines

Published Applications:

1

Last publication date:

2023-11-02

Recent patent applications by Milo Michael

Michael Milo from Baguio City, PH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-11-02

US20230352441A1

BUMP TO PACKAGE SUBSTRATE SOLDER JOINT

InventorID:

5898282 ⎘