Eußenheim
Germany
7
2026-01-29
Christoph Bayer from Eußenheim, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for Producing Molded Electronic Devices
#2 | 2026-01-22SEMICONDUCTOR DIE WITH BOND PAD FORMED FROM NANOWIRES
#3 | 2025-11-13Method for Attaching Metallic Bodies to Thin Semiconductor Dies at Wafer Level
#4 | 2025-08-28SEMICONDUCTOR MODULE ARRANGEMENT
#5 | 2024-09-12SEMICONDUCTOR MODULE ARRANGEMENT
#6 | 2024-05-16SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGEMENT
#7 | 2023-11-09Semiconductor Package Comprising Structures Configured to Withstand a Change of the Volume of a Potting Compound
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