Wei Chun CHEN

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2025-05-29

Top Assignees for applications by Wei Chun CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Wei Chun:

Wei Chun CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

BUFFER PACKAGING STRUCTURE AND PACKING BOX STRUCTURE

Buffer structure, packaging set, and buffer structure forming method

SUPPORTING STRUCTURE AND PACKING BOX

Method for growing aluminum indium nitride films on silicon substrate

InventorID:

5907249 ⎘