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Inventor profile of:

Srikanth KULKARNI

City:

Dublin, California

Country:

United States

Published Applications:

1

Last publication date:

2023-11-16

Recent patent applications by KULKARNI Srikanth

Srikanth KULKARNI from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-11-16

US20230369234A1

PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURED FOR HIGH DENSITY INTERCONNECTION

InventorID:

5910892 ⎘