Richardson, Texas
United States
9
2026-04-30
Blake Travis from Richardson, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SMALL FORM FACTOR SEMICONDUCTOR PACKAGE WITH LOW ELECTROMIGRATION
#2 | 2026-04-02SUBSTRATE PACKAGE HAVING MOISTURE DISSIPATION CHANNELS
#3 | 2026-03-05ELECTRONIC DEVICE WITH INDENTED DIE BACKSIDE
#4 | 2026-03-05MULTI-LAYER ELECTRONIC DEVICE PACKAGE
#5 | 2026-02-05DELAMINATION MITIGATION FOR AN INTEGRATED CIRCUIT
#6 | 2025-08-28ELECTRONIC DEVICE DUAL SIDE MOLDED SOLDERMASKLESS PACKAGE SUBSTRATE PACKAGE FOR IMPROVED THERMAL DISSIPATION AND THERMOMECHANICAL INTEGRITY
#7 | 2024-05-02FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND POWER METALLIZATION
#8 | 2023-11-23MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT
#9 | 2023-11-23THERMAL TEST CHIP WITH STACKABLE METAL BASED HEATER AND SENSOR
5916846 ⎘