Ryuji AKEBI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-03-12

Top Assignees for applications by Ryuji AKEBI

The entities that hold a legal rights for patent applications filed by inventor AKEBI Ryuji:

RESONAC CORPORATION 3 Tokyo, Japan
Showa Denko Materials Co., Ltd. 1 Tokyo, Japan

Recent patent applications by AKEBI Ryuji

Ryuji AKEBI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-12

US20260071011A1

Chemistry; metallurgy

COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

#2 | 2025-06-12

US20250188263A1

Chemistry; metallurgy

RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

#3 | 2024-01-25

US20240032209A1

Electricity

Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package

#4 | 2023-12-07

US20230392001A1

Chemistry; metallurgy

Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package

#5 | 2023-12-07

US20230391940A1

Chemistry; metallurgy

MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

#6 | 2020-12-24

US20200399493A1

Chemistry; metallurgy

Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor

InventorID:

5926718 ⎘