Phoenix, Arizona
United States
10
2016-09-13
The entities that hold a legal rights for patent applications filed by inventor DANIELS Dwight L.:
Dwight L. DANIELS from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of bond pad protection during wafer processing
#2 | 2016-05-12Environmental sensor structure
#3 | 2015-08-13Semiconductor device package and method of manufacture
#4 | 2014-11-20Semiconductor device package and method of manufacture
#5 | 2014-05-15Wettable lead ends on a flat-pack no-lead microelectronic package
#6 | 2014-01-02Semiconductor device package and method of manufacture
#7 | 2012-10-25Methods for fabricating sensor device package using a sealing structure
#8 | 2012-10-25Sensor device with sealing structure
#9 | 2011-10-06Semiconductor device with a controlled cavity and method of formation
#10 | 2011-07-26Semiconductor device with a controlled cavity and method of formation
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