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Inventor profile of:

Jun Wan

City:

Chengdu

Country:

China

Published Applications:

3

Last publication date:

2026-01-08

Recent patent applications by Wan Jun

Jun Wan from Chengdu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-08

US20260011387A1

CHIP AGING METHOD AND APPARATUS

#2 | 2025-01-30

US20250036514A1

MEMORY ERROR PREDICTION METHOD AND APPARATUS, AND DEVICE

#3 | 2023-12-07

US20230395448A1

Chip Package Structure and Electronic Device

InventorID:

5929775 ⎘