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Inventor profile of:

Ranjit Borude

City:

Tokyo

Country:

Japan

Published Applications:

5

Last publication date:

2025-07-10

Recent patent applications by Borude Ranjit

Ranjit Borude from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-10
US20250226214A1
Electricity

METHODS AND APPARATUSES FOR FILLING A GAP

#2 | 2025-05-29
US20250171892A1
Chemistry; metallurgy

APPARATUSES AND METHODS FOR FILLING A GAP

#3 | 2025-04-17
US20250122610A1
Chemistry; metallurgy

Method and system for filling a gap

#4 | 2025-01-02
US20250006489A1
Electricity

METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP

#5 | 2023-12-14
US20230399745A1
Chemistry; metallurgy

METHODS AND APPARATUSES FOR FLOWABLE GAP FILL

InventorID:

5933169 ⎘

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