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Inventor profile of:

Ryan S. Heller

City:

Newark, Delaware

Country:

United States

Published Applications:

2

Last publication date:

2024-10-03

Recent patent applications by Heller Ryan S.

Ryan S. Heller from Newark, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-03

US20240330876A1

CORRESPONDENCE DATA HUB

#2 | 2024-01-04

US20240005427A1

ORCHESTRATION LAYER FOR A MULTI-TIER ARCHITECTURE

InventorID:

5956258 ⎘