Nagano
Japan
5
2025-03-13
The entities that hold a legal rights for patent applications filed by inventor UCHIDA Kensuke:
Kensuke UCHIDA from Nagano, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
#2 | 2025-02-13WIRING BOARD AND SEMICONDUCTOR DEVICE
#3 | 2024-07-04INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTOR APPARATUS
#4 | 2024-01-11WIRING BOARD
#5 | 2022-05-19Wiring substrate and semiconductor device
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