Kohei MITANI

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-05-16

Top Assignees for applications by Kohei MITANI

The entities that hold a legal rights for patent applications filed by inventor MITANI Kohei:

SEKISUI KASEI CO., LTD. 2 Osaka, Japan

Recent patent applications by MITANI Kohei

Kohei MITANI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-05-16

US20240158553A1

Chemistry; metallurgy

FINE RESIN PARTICLE, COATING FILM-SOFTENING AGENT, MATTING AGENT FOR PAINTS, STRESS RELIEVER FOR CURABLE RESINS, LIGHT DIFFUSER, LIGHT DIFFUSING RESIN COMPOSITION, AND RESIN COMPOSITION

#2 | 2024-01-18

US20240018286A1

Chemistry; metallurgy

FINE RESIN PARTICLE AND APPLICATION THEREOF

InventorID:

5966420 ⎘