Ayaka SEICHI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-01-18

Top Assignees for applications by Ayaka SEICHI

The entities that hold a legal rights for patent applications filed by inventor SEICHI Ayaka:

Ayaka SEICHI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR ENHANCING ADHESION STRENGTH OF RESIN MOLDED ARTICLE TO AN ADHESIVE, AND COMPOSITE ENHANCED IN ADHESION STRENGTH

InventorID:

5966445 ⎘