Daisuke OKUYAMA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-05-29

Top Assignees for applications by Daisuke OKUYAMA

The entities that hold a legal rights for patent applications filed by inventor OKUYAMA Daisuke:

Daisuke OKUYAMA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

LEAD FRAME AND MANUFACTURING METHOD THEREOF

LEAD FRAME AND MANUFACTURING METHOD THEREOF

LEAD FRAME AND MANUFACTURING METHOD THEREOF

Lead frame and manufacturing method thereof

InventorID:

5975807 ⎘