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Inventor profile of:

Tomoya MURATA

City:

Aichi

Country:

Japan

Published Applications:

1

Last publication date:

2024-02-01

Top Assignees for applications by Tomoya MURATA

The entities that hold a legal rights for patent applications filed by inventor MURATA Tomoya:

MITSUBISHI HEAVY INDUSTRIES, LTD. 1 Tokyo, Japan

Recent patent applications by MURATA Tomoya

Tomoya MURATA from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-01

US20240034010A1

Performing operations; transporting

SHAPING METHOD AND SHAPING DEVICE

InventorID:

5978352 ⎘