Amram Eitan

BONDING STRUCTURES FORMED USING SELECTIVE SURFACE TREATMENT OF COPPER BUMPS AND METHODS OF FORMING THE SAME

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND METHODS FOR PERFORMING THE SAME

SYSTEMS FOR OPTICAL OXIDE DETECTION IN SEMICONDUCTOR DEVICES AND METHODS FOR PERFORMING THE SAME

DIE EJECTOR HAVING INDEPENDENTLY ENGAGED EJECTOR RODS, METHOD OF PERFORMING DIE PICK-UP WITH THE DIE EJECTOR, AND DIE EJECTOR SYSTEM INCLUDING THE DIE EJECTOR

DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS FOR FORMING THE SAME

IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STRUCTURES AND METHODS OF FORMING THE SAME

BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE USING THE APPARATUS

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION CONTROL AND METHODS FOR USING THE SAME

POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING AND APPARATUS FOR EFFECTING THE SAME

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARATUS FOR EFFECTING THE SAME

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND METHODS FOR PERFORMING THE SAME

SEMICONDUCTOR PACKAGE WITH A STACKED FILM STRUCTURE TO REDUCE CRACKING AND DELAMINATION AND METHODS OF MAKING THE SAME