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Inventor profile of:

Tanlin CHEN

City:

Wuhan

Country:

China

Published Applications:

1

Last publication date:

2024-02-08

Recent patent applications by CHEN Tanlin

Tanlin CHEN from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-08

US20240047416A1

CHIP-TO-WAFER STACKING METHOD

InventorID:

5989006 ⎘