Hsinchu
Taiwan
9
2026-07-02
The entities that hold a legal rights for patent applications filed by inventor Yan Kathy:
Kathy Yan from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROGENEOUS PACKAGES AND METHODS FOR FORMING THE SAME
#2 | 2026-04-30PACKAGE STRUCTURE INCLUDING COMPOSITE THERMAL INTERFACE MATERIAL LAYER AND METHODS OF FORMING THE SAME
#3 | 2026-04-16SEMICONDUCTOR MODULE INCLUDING A BACKSIDE CAPACITOR, PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR MODULE AND METHODS OF FORMING THE SAME
#4 | 2026-04-16SIDEWALL PADDING FOR A SEMICONDUCTOR DIE FOR STRESS ABSORPTION AND METHODS OF FORMING THE SAME
#5 | 2025-03-20INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
#6 | 2024-11-21THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
#7 | 2024-04-18Integrated Circuit Packages and Methods of Forming the Same
#8 | 2024-02-22THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROGENEOUS PACKAGES AND METHODS FOR FORMING THE SAME
#9 | 2024-02-15THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
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