Takako Ejiri

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2022-06-02

Top Assignees for applications by Takako Ejiri

The entities that hold a legal rights for patent applications filed by inventor Ejiri Takako:

Takako Ejiri from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package

InventorID:

5997197 ⎘