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Inventor profile of:

Jun Kamada

City:

Narashino

Country:

Japan

Published Applications:

12

Last publication date:

2021-12-16

Top Assignees for applications by Jun Kamada

The entities that hold a legal rights for patent applications filed by inventor Kamada Jun:

MITSUI CHEMICALS, INC. 8 Tokyo, Japan
MITSUI CHEMICALS, INC. 4 Minato-ku, Tokyo, Japan
Mitsui Chemicals Tohcello, Inc. 2 Tokyo, Japan
MITSUI CHEMICALS TOHCELLO, INC. 2 Chiyoda-ku, Tokyo, Japan
Mitsui Chemicals Tohcello, Inc. 1 Chiyoda-ku, Japan
MITSUI CHEMICALS TEHCELLO, INC. 1 Tokyo, Japan

Recent patent applications by Kamada Jun

Jun Kamada from Narashino, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-12-16

US20210391292A1

Method of manufacturing substrate layered body and layered body

#2 | 2020-12-03

US20200377772A1

Chemistry; metallurgy

Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same

#3 | 2020-07-09

US20200219823A1

Method of producing electronic device

#4 | 2020-07-09

US20200219734A1

Method of producing electronic device

#5 | 2020-06-11

US20200181457A1

Chemistry; metallurgy

Adhesive member and production method for adhesive member

#6 | 2020-05-28

US20200168476A1

Method for producing semiconductor device and intermediate for semiconductor device

#7 | 2020-02-13

US20200048515A1

Chemistry; metallurgy

Substrate laminated body and method of manufacturing substrate laminated body

#8 | 2019-10-17

US20190315910A1

Chemistry; metallurgy

Blocked isocyanate, coating composition, adhesive composition, and article

#9 | 2019-07-11

US20190211241A1

Chemistry; metallurgy

Curable composition, coating material, solar cell coating material, solar cell back sheet coating material, adhesive, solar cell adhesive, solar cell back sheet adhesive, producing method of sheet, and curing agent

#10 | 2018-07-12

US20180197764A1

Semiconductor wafer surface protection film and method for manufacturing semiconductor device

#11 | 2016-07-14

US20160200858A1

Chemistry; metallurgy

Blocked isocyanate, coating composition, adhesive composition, and article

#12 | 2014-10-30

US20140322474A1

Chemistry; metallurgy

Adhesive resin composition, laminate, and self-stripping method

InventorID:

5998970 ⎘