Yuusuke Ohshima

City:

Tsukuba

Country:

Japan

Published Applications:

Last publication date:

2025-05-22

Top Assignees for applications by Yuusuke Ohshima

The entities that hold a legal rights for patent applications filed by inventor Ohshima Yuusuke:

TANAKA KIKINZOKU KOGYO K.K. 9 Tokyo, Japan
Tanaka Kikinzoku Kogyo K.K. 1 Chiyoda-ku, Tokyo, Japan
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM 1 Nagoya-shi, Aichi, Japan
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. 1 Tokyo, Japan
National University Corporation Tokai National Higher Education and Research System 1 Nagoya, Japan

Recent patent applications by Ohshima Yuusuke

Yuusuke Ohshima from Tsukuba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-22

US20250163320A1

Chemistry; metallurgy

SEMICONDUCTOR NANOPARTICLES COMPOSED OF AgAuS-BASED MULTICOMPONENT COMPOUND

#2 | 2024-10-10

US20240336763A1

Chemistry; metallurgy

METAL PASTE

#3 | 2023-06-22

US20230197311A1

Electricity

Metal wiring and conductive sheet both excellent in bending resistance, and metal paste for forming the metal wiring

#4 | 2022-08-04

US20220248538A1

Electricity

Method for forming metal pattern

#5 | 2022-01-13

US20220015232A1

Electricity

Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring

#6 | 2021-10-21

US20210324218A1

Chemistry; metallurgy

Silver ink for low-temperature calcination

#7 | 2020-05-07

US20200140710A1

Chemistry; metallurgy

Metal ink

#8 | 2016-05-05

US20160121404A1

Performing operations; transporting

Method for manufacturing silver particles

#9 | 2015-08-20

US20150237742A1

Electricity

Method for treating substrate that support catalyst particles for plating processing

InventorID:

5999985 ⎘