Inventor profile of:

Daisuke Kori

City:

Joetsu

Country:

Japan

Published Applications:

45

Last publication date:

2023-09-07

Top Assignees for applications by Daisuke Kori

The entities that hold a legal rights for patent applications filed by inventor Kori Daisuke:

Recent patent applications by Kori Daisuke

Daisuke Kori from Joetsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-09-07
US20230280655A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND

#2 | 2023-08-17
US20230260787A1
Electricity

COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN

#3 | 2023-08-03
US20230244147A1
Physics

COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND AND POLYMER FOR FORMING ORGANIC FILM

#4 | 2023-05-04
US20230140810A1
Physics

MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM

#5 | 2023-04-20
US20230121798A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND

#6 | 2022-08-25
US20220269175A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

#7 | 2022-07-07
US20220214618A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER

#8 | 2022-07-07
US20220214617A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, COMPOUND, AND POLYMER

#9 | 2022-06-09
US20220179317A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#10 | 2022-05-26
US20220163890A1
Physics

Resist underlayer film material, patterning process, and method for forming resist underlayer film

#11 | 2022-04-07
US20220107566A1
Physics

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

#12 | 2021-12-23
US20210397092A1
Physics

Resist underlayer film material, patterning process, and method for forming resist underlayer film

#13 | 2021-10-07
US20210311395A1
Physics

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#14 | 2021-09-16
US20210286266A1
Physics

Material for forming organic film, method for forming organic film, patterning process, and compound

#15 | 2021-09-09
US20210278766A1
Physics

Coating-type composition for forming organic film, patterning process, polymer, and method for manufacturing polymer

#16 | 2021-09-02
US20210269597A1
Chemistry; metallurgy

Material for forming organic film, patterning process, and polymer

#17 | 2021-07-01
US20210198472A1
Chemistry; metallurgy

Material for forming organic film, method for forming organic film, patterning process, and compound

#18 | 2021-06-17
US20210181637A1
Physics

Material for forming organic film, method for forming organic film, patterning process, and compound

#19 | 2021-06-03
US20210163675A1
Chemistry; metallurgy

Material for forming organic film, patterning process, and polymer

#20 | 2021-01-14
US20210011384A1
Physics

Composition for forming organic film, patterning process, and polymer

#21 | 2021-01-07
US20210003920A1
Physics

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymer

#22 | 2020-12-10
US20200387071A1
Physics

Composition for forming organic film, patterning process, and polymer

#23 | 2020-12-03
US20200381247A1
Electricity

Material for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#24 | 2020-11-19
US20200363723A1
Physics

Composition for forming organic film, patterning process, and polymer

#25 | 2020-11-12
US20200356007A1
Physics

Composition for forming organic film, patterning process, and polymer

#26 | 2020-10-22
US20200333709A1
Physics

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#27 | 2020-10-22
US20200332062A1
Chemistry; metallurgy

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#28 | 2019-06-27
US20190198341A1
Electricity

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process

#29 | 2019-06-27
US20190194391A1
Chemistry; metallurgy

Method for producing dihydroxynaphthalene condensate and dihydroxynaphthalene condensate

#30 | 2019-02-28
US20190067021A1
Electricity

Polymer and composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#31 | 2019-02-28
US20190064659A1
Physics

Composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, patterning process, and polymer

#32 | 2019-01-24
US20190027369A1
Electricity

Composition for forming organic film, patterning process, and resin for forming organic film

#33 | 2018-11-01
US20180315594A1
Electricity

Method of cleaning and drying semiconductor substrate

#34 | 2018-10-04
US20180284615A1
Physics

Resist underlayer film composition, patterning process, and method for forming resist underlayer film

#35 | 2018-10-04
US20180284614A1
Physics

Resist underlayer film composition, patterning process, and method for forming resist underlayer film

#36 | 2016-06-02
US20160154314A1
Physics

Rinse solution for pattern formation and pattern forming process

#37 | 2016-06-02
US20160154312A1
Physics

Rinse solution for pattern formation and pattern forming process

#38 | 2014-12-11
US20140363958A1
Electricity

Underlayer film-forming composition and pattern forming process

#39 | 2014-12-11
US20140363957A1
Electricity

Underlayer film-forming composition and pattern forming process

#40 | 2014-12-11
US20140363956A1
Electricity

Underlayer film-forming composition and pattern forming process

#41 | 2014-12-11
US20140363955A1
Electricity

Underlayer film-forming composition and pattern forming process

#42 | 2014-12-11
US20140363768A1
Chemistry; metallurgy

Naphthalene derivative, resist bottom layer material, and patterning process

#43 | 2012-10-04
US20120252218A1
Chemistry; metallurgy

Biphenyl derivative, resist bottom layer material, bottom layer forming method, and patterning process

#44 | 2012-03-15
US20120064725A1
Chemistry; metallurgy

Naphthalene derivative, resist bottom layer material, and patterning process

#45 | 2011-12-22
US20110311920A1
Chemistry; metallurgy

Naphthalene derivative, resist bottom layer material, resist bottom layer forming method, and patterning process

InventorID:

6004628 ⎘