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Inventor profile of:

Keisuke Niida

City:

Joetsu

Country:

Japan

Published Applications:

Last publication date:

2023-08-17

Top Assignees for applications by Keisuke Niida

The entities that hold a legal rights for patent applications filed by inventor Niida Keisuke:

SHIN-ETSU CHEMICAL CO., LTD 16 Tokyo, Japan
INTERNATIONAL BUSINESS MACHINES CORPORATION 2 ARMONK, NY United States

Recent patent applications by Niida Keisuke

Keisuke Niida from Joetsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-08-17

US20230260787A1

Electricity

COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN

#2 | 2022-07-14

US20220221793A1

Physics

COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND SILICON COMPOUND

#3 | 2021-10-07

US20210311395A1

Physics

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#4 | 2021-09-09

US20210278766A1

Physics

Coating-type composition for forming organic film, patterning process, polymer, and method for manufacturing polymer

#5 | 2021-09-02

US20210269597A1

Chemistry; metallurgy

Material for forming organic film, patterning process, and polymer

#6 | 2021-01-07

US20210003920A1

Physics

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymer

#7 | 2020-12-03

US20200381247A1

Electricity

Material for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#8 | 2020-10-22

US20200333709A1

Physics

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#9 | 2020-10-22

US20200332062A1

Chemistry; metallurgy

Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film

#10 | 2019-12-26

US20190391493A1

Physics

Compound and composition for forming organic film

#11 | 2019-12-26

US20190390000A1

Chemistry; metallurgy

Compound, method for manufacturing the compound, and composition for forming organic film

#12 | 2019-10-24

US20190322903A1

Chemistry; metallurgy

Adhesive film, method for forming an adhesive film, and urethane polymer

#13 | 2019-10-03

US20190300498A1

Chemistry; metallurgy

Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#14 | 2019-05-23

US20190151648A1

Human necessities

Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode

#15 | 2019-02-28

US20190067021A1

Electricity

Polymer and composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process

#16 | 2019-02-28

US20190064659A1

Physics

Composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, patterning process, and polymer

InventorID:

6004630 ⎘