Hiroki Kono

City:

Ibaraki

Country:

Japan

Published Applications:

Last publication date:

2022-12-22

Top Assignees for applications by Hiroki Kono

The entities that hold a legal rights for patent applications filed by inventor Kono Hiroki:

Hiroki Kono from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Pressure-sensitive adhesive sheet for semiconductor wafer processing

Encapsulating sheet and optical semiconductor element device

InventorID:

6006972 ⎘