Omuta
Japan
12
2022-04-21
The entities that hold a legal rights for patent applications filed by inventor Ishihara Yosuke:
Yosuke Ishihara from Omuta, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Heat dissipation member
#2 | 2022-01-20Package accommodating heat dissipation substrate and packing box
#3 | 2020-10-22Heat dissipation component and method for manufacturing same
#4 | 2019-11-07Heat dissipation component for semiconductor element
#5 | 2019-03-28Aluminum-diamond-based composite and heat dissipation component
#6 | 2018-10-04Aluminum-diamond-based composite and method for producing same
#7 | 2017-11-02Heat dissipation component and method for manufacturing same
#8 | 2017-09-21Heat dissipation component for semiconductor element
#9 | 2017-05-11Composite body and method for manufacturing same
#10 | 2017-02-16Aluminum-diamond composite, and heat dissipating component using same
#11 | 2014-11-20Clad material for LED light-emitting element holding substrate, and method for manufacturing same
#12 | 2011-12-29Composite substrate for LED light emitting element, method of production of same, and LED light emitting element
6008020 ⎘