Daisuke Goto

City:

Omuta

Country:

Japan

Published Applications:

Last publication date:

2022-11-17

Top Assignees for applications by Daisuke Goto

The entities that hold a legal rights for patent applications filed by inventor Goto Daisuke:

Denka Company Limited 9 Tokyo, Japan
Denka Company Limited 1 Chuo-ku, Tokyo, Japan
DENKI KAGAKU KOGYO KABUSHIKI KAISHA 1 Tokyo, Japan

Recent patent applications by Goto Daisuke

Daisuke Goto from Omuta, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-11-17

US20220369499A1

Electricity

Heat dissipation member and method of manufacturing the same

#2 | 2022-04-21

US20220124936A1

Electricity

Heat dissipation member

#3 | 2022-03-31

US20220104400A1

Electricity

Heat dissipation member and method of manufacturing the same

#4 | 2022-01-20

US20220017282A1

Performing operations; transporting

Package accommodating heat dissipation substrate and packing box

#5 | 2020-10-22

US20200335415A1

Electricity

Heat dissipation component and method for manufacturing same

#6 | 2018-08-02

US20180215668A1

Chemistry; metallurgy

Aluminum-silicon-carbide composite and method of manufacturing same

#7 | 2018-01-25

US20180025919A1

Electricity

Method for producing silicon carbide composite material

#8 | 2017-11-02

US20170317007A1

Electricity

Heat dissipation component and method for manufacturing same

#9 | 2017-04-20

US20170107158A1

Chemistry; metallurgy

Aluminium-silicon carbide composite, and power-module base plate

InventorID:

6008021 ⎘