Inventor profile of:

Yusuke Biyajima

City:

Joetsu

Country:

Japan

Published Applications:

17

Last publication date:

2023-10-19

Top Assignees for applications by Yusuke Biyajima

The entities that hold a legal rights for patent applications filed by inventor Biyajima Yusuke:

Recent patent applications by Biyajima Yusuke

Yusuke Biyajima from Joetsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-10-19
US20230333472A1
Physics

THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS

#2 | 2023-08-03
US20230244149A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#3 | 2023-06-29
US20230203354A1
Chemistry; metallurgy

MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM

#4 | 2023-02-23
US20230059089A1
Physics

MATERIAL FOR FORMING ADHESIVE FILM, METHOD FOR FORMING ADHESIVE FILM USING THE SAME, AND PATTERNING PROCESS USING MATERIAL FOR FORMING ADHESIVE FILM

#5 | 2022-05-26
US20220163890A1
Physics

Resist underlayer film material, patterning process, and method for forming resist underlayer film

#6 | 2021-12-23
US20210397092A1
Physics

Resist underlayer film material, patterning process, and method for forming resist underlayer film

#7 | 2021-09-16
US20210286266A1
Physics

Material for forming organic film, method for forming organic film, patterning process, and compound

#8 | 2021-07-01
US20210198472A1
Chemistry; metallurgy

Material for forming organic film, method for forming organic film, patterning process, and compound

#9 | 2021-06-17
US20210181637A1
Physics

Material for forming organic film, method for forming organic film, patterning process, and compound

#10 | 2021-03-25
US20210088908A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#11 | 2021-01-28
US20210026246A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#12 | 2020-10-29
US20200341377A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#13 | 2020-10-29
US20200340806A1
Physics

Method for measuring distance of diffusion of curing catalyst

#14 | 2020-07-23
US20200233303A1
Physics

Composition for forming silicon-containing resist underlayer film and patterning process

#15 | 2020-05-21
US20200159120A1
Physics

Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process

#16 | 2019-06-27
US20190198341A1
Electricity

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process

#17 | 2014-08-21
US20140234785A1
Physics

Pattern forming process

InventorID:

6011102 ⎘