Eiji Kurose

City:

Ojiya

Country:

Japan

Published Applications:

Last publication date:

2023-04-20

Top Assignees for applications by Eiji Kurose

The entities that hold a legal rights for patent applications filed by inventor Kurose Eiji:

Eiji Kurose from Ojiya, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Methods of forming semiconductor packages with back side metal

Methods of forming semiconductor packages with back side metal

InventorID:

6012402 ⎘