San Francisco, California
United States
16
2026-05-28
The entities that hold a legal rights for patent applications filed by inventor Chen Jack:
Jack Chen from San Francisco, US has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
#2 | 2026-05-21PLASMA-EXCLUSION-ZONE RINGS WITH PLASMA-EXCLUSION-ZONE RING NOTCHES FOR SUBSTRATE PROCESSING SYSTEMS
#3 | 2026-05-07PRESSURE CONTROL SYSTEM FOR A BEVEL EDGE ETCH CHAMBER IMPLEMENTING SUBSTRATE FRONTSIDE AND BACKSIDE PRESSURE CONTROL
#4 | 2025-11-27LOWER PLASMA EXCLUSION ZONE RINGS FOR BEVEL ETCHER
#5 | 2024-06-27IN-SITU WAFER THICKNESS AND GAP MONITORING USING THROUGH BEAM LASER SENSOR
#6 | 2023-12-14TUNABLE UPPER PLASMA-EXCLUSION-ZONE RING FOR A BEVEL ETCHER
#7 | 2023-11-02PLASMA-EXCLUSION-ZONE RINGS FOR PROCESSING NOTCHED WAFERS
#8 | 2023-10-05WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
#9 | 2023-07-06Arcing Reduction in Wafer Bevel Edge Plasma Processing
#10 | 2023-05-11FRONTSIDE AND BACKSIDE PRESSURE MONITORING FOR SUBSTRATE MOVEMENT PREVENTION
#11 | 2021-11-11LOWER PLASMA EXCLUSION ZONE RING FOR BEVEL ETCHER
#12 | 2021-05-20Tunable upper plasma-exclusion-zone ring for a bevel etcher
#13 | 2017-09-07Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning
#14 | 2015-04-09Tunable upper plasma-exclusion-zone ring for a bevel etcher
#15 | 2015-01-22Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning
#16 | 2014-01-09METHODS AND APPARATUS FOR BEVEL EDGE CLEANING IN A PLASMA PROCESSING SYSTEM
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