Hisai Ueda

City:

Nonoichi

Country:

Japan

Published Applications:

Last publication date:

2021-06-10

Top Assignees for applications by Hisai Ueda

The entities that hold a legal rights for patent applications filed by inventor Ueda Hisai:

KANAZAWA INSTITUTE OF TECHNOLOGY 1 Ishikawa, Japan
SUNCORONA ODA CO., LTD. 1 Ishikawa, Japan

Recent patent applications by Ueda Hisai

Hisai Ueda from Nonoichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-06-10

US20210171728A1

Chemistry; metallurgy

Fiber-reinforced thermoplastic resin sheet, molded body of fiber-reinforced thermoplastic resin sheet, and manufacturing method of fiber-reinforced thermoplastic resin sheet

InventorID:

6019357 ⎘