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Inventor profile of:

Taisuke Higashi

City:

Itami

Country:

Japan

Published Applications:

Last publication date:

2023-01-19

Top Assignees for applications by Taisuke Higashi

The entities that hold a legal rights for patent applications filed by inventor Higashi Taisuke:

SUMITOMO ELECTRIC HARDMETAL CORP. 7 Itami-shi, Japan
Sumitomo Electric Hardmetal Corp. 6 Itami, Japan
SUMITOMO ELECTRIC INDUSTRIES, LTD. 6 Osaka-shi, Japan
SUMITOMO ELECTRIC HARDMETAL CORP 3 Itami-shi, Hyogo, Japan
SUMITOMO ELECTRIC INDUSTRIES, LTD. 2 Osaka, Japan
SUMITOMO ELECTRIC HARDMETAL CORP. 1 Hyogo, Japan

Recent patent applications by Higashi Taisuke

Taisuke Higashi from Itami, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-01-19

US20230015407A1

Performing operations; transporting

Rotary cutting tool

#2 | 2021-08-05

US20210238716A1

Chemistry; metallurgy

Composite sintered material

#3 | 2021-08-05

US20210238100A1

Chemistry; metallurgy

Polycrystalline cubic boron nitride and method for manufacturing the same

#4 | 2021-08-05

US20210238036A1

Chemistry; metallurgy

Polycrystalline cubic boron nitride and method for manufacturing the same

#5 | 2021-03-25

US20210087058A1

Chemistry; metallurgy

Polycrystalline cubic boron nitride and method for manufacturing the same

#6 | 2020-04-02

US20200102252A1

Chemistry; metallurgy

Composite sintered material

#7 | 2019-01-03

US20190001423A1

Performing operations; transporting

Cutting tool

#8 | 2018-12-27

US20180369924A1

Performing operations; transporting

Cutting tool

#9 | 2018-12-20

US20180361485A1

Performing operations; transporting

Cutting tool

#10 | 2018-12-06

US20180345380A1

Performing operations; transporting

Rotary cutting blade material and method for manufacturing the same

#11 | 2016-08-04

US20160221080A1

Performing operations; transporting

Bonded diamond body, tool comprising the same, and method for manufacturing bonded diamond body

InventorID:

6020260 ⎘