Remi Perrin

City:

Rennes

Country:

France

Published Applications:

Last publication date:

2024-07-11

Top Assignees for applications by Remi Perrin

The entities that hold a legal rights for patent applications filed by inventor Perrin Remi:

Remi Perrin from Rennes, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA TECHNIQUE AND ASSEMBLY USING SUCH PCB

Power module and method for manufacturing power module

InventorID:

6020897 ⎘