Dali
Taiwan
14
2023-10-26
The entities that hold a legal rights for patent applications filed by inventor Chen Yung-Ching:
Yung-Ching Chen from Dali, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Pad structure for enhanced bondability
#2 | 2022-05-05Pad structure for enhanced bondability
#3 | 2020-04-23Pad structure for enhanced bondability
#4 | 2016-10-13Interconnect structure for CIS flip-chip bonding and methods for forming the same
#5 | 2016-09-29Molded underfilling for package on package devices
#6 | 2016-02-04Package on package devices and methods of packaging semiconductor dies
#7 | 2015-02-26Interconnect structure for CIS flip-chip bonding and methods for forming the same
#8 | 2014-05-08Molded underfilling for package on package devices
#9 | 2014-02-13Package on package devices and methods of forming same
#10 | 2014-02-13Looped interconnect structure
#11 | 2014-01-23Package on package devices and methods of packaging semiconductor dies
#12 | 2014-01-16Interconnect structure for CIS flip-chip bonding and methods for forming the same
#13 | 2014-01-02System and method for forming uniform rigid interconnect structures
#14 | 2013-10-24Rigid interconnect structures in package-on-package assemblies
6022907 ⎘