Hsinchu
Taiwan
3
2022-03-31
The entities that hold a legal rights for patent applications filed by inventor Lee Chung-Fa:
Chung-Fa Lee from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
#2 | 2020-07-30Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
#3 | 2020-07-30Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
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