Taichung
Taiwan
5
2020-05-14
The entities that hold a legal rights for patent applications filed by inventor Dow Wei-Ping:
Wei-Ping Dow from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Composite with hollow nano-structures and application thereof
#2 | 2019-12-12Method for manufacturing copper foil with rough surface in plating tank and its product
#3 | 2018-11-29Method for producing flexible conductive substrate with high transmittance and product thereof
#4 | 2018-02-08Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO
#5 | 2015-08-11Method of coating surface of substrate hole with layer of reduced graphene oxide
6027107 ⎘