Satoru Daido

City:

Sanda

Country:

Japan

Published Applications:

Last publication date:

2021-08-26

Top Assignees for applications by Satoru Daido

The entities that hold a legal rights for patent applications filed by inventor Daido Satoru:

Satoru Daido from Sanda, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic component and method of manufacturing electronic component

Lid material for packages including reflowed gold-tin layers, and method for manufacturing package

Method for manufacturing package lid member and method for manufacturing package

InventorID:

6029133 ⎘