Tainan
Taiwan
12
2023-11-16
The entities that hold a legal rights for patent applications filed by inventor Chen Ping-Tzu:
Ping-Tzu Chen from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Backside contact to improve thermal dissipation away from semiconductor devices
#2 | 2023-11-09Oversized via as through-substrate-via (TSV) stop layer
#3 | 2023-11-02SUPPORT STRUCTURE TO REINFORCE STACKED SEMICONDUCTOR WAFERS
#4 | 2023-09-14Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
#5 | 2023-06-15Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate
#6 | 2023-06-01Shared pad/bridge layout for a 3D IC
#7 | 2022-07-07Backside contact to improve thermal dissipation away from semiconductor devices
#8 | 2022-06-30Oversized via as through-substrate-via (TSV) stop layer
#9 | 2022-03-24Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
#10 | 2021-12-16Backside contact to improve thermal dissipation away from semiconductor devices
#11 | 2021-12-16Oversized via as through-substrate-via (TSV) stop layer
#12 | 2021-03-18Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
6032196 ⎘