Hsinchu
Taiwan
24
2024-04-18
The entities that hold a legal rights for patent applications filed by inventor Wan Albert:
Albert Wan from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor packages and manufacturing methods thereof
#2 | 2023-09-28Semiconductor device having antenna and manufacturing method thereof
#3 | 2022-11-17Semiconductor packages and manufacturing methods thereof
#4 | 2021-08-19Semiconductor packages and manufacturing methods thereof
#5 | 2021-04-01Package structure and manufacturing method thereof
#6 | 2020-10-22Integrated fan-out package and manufacturing method thereof
#7 | 2020-10-22Semiconductor device having antenna on chip package and manufacturing method thereof
#8 | 2020-08-27Semiconductor device and manufacturing method thereof
#9 | 2020-08-13Semiconductor packages and manufacturing methods thereof
#10 | 2020-03-19Semiconductor package, semiconductor device and method for packaging semiconductor device
#11 | 2020-02-20Package structure and manufacturing method thereof
#12 | 2019-11-26Packaging of semiconductor device with antenna and heat spreader
#13 | 2019-11-21Method of manufacturing integrated fan-out package
#14 | 2019-10-31Semiconductor device having antenna and manufacturing method thereof
#15 | 2019-07-30Method of manufacturing integrated fan-out package
#16 | 2019-05-23Package structure and manufacturing method thereof
#17 | 2019-05-23Package structure having connecting module
#18 | 2019-04-18Semiconductor packages and manufacturing methods thereof
#19 | 2019-02-28Package structure and method of fabricating package structure
#20 | 2019-01-24Package structure and manufacturing method thereof
#21 | 2018-05-31Semiconductor structure and method of manufacturing the same
#22 | 2018-05-10Semiconductor device structure
#23 | 2018-01-18Semiconductor device structure and method for forming the same
#24 | 2017-11-30Sensor packages and manufacturing mehtods thereof
6032201 ⎘