Ryosuke Yanaka

City:

Isesaki

Country:

Japan

Published Applications:

Last publication date:

2021-06-03

Top Assignees for applications by Ryosuke Yanaka

The entities that hold a legal rights for patent applications filed by inventor Yanaka Ryosuke:

Ryosuke Yanaka from Isesaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Laminated sheet and electronic component packaging container molded using same

InventorID:

6033630 ⎘