Junfeng Cui

City:

Dalian

Country:

China

Published Applications:

Last publication date:

2020-04-30

Top Assignees for applications by Junfeng Cui

The entities that hold a legal rights for patent applications filed by inventor Cui Junfeng:

Junfeng Cui from Dalian, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

TEM electromechanical in-situ testing method of one-dimensional materials

Method for moving and transferring nanowires using tapered hair of diameter on micron range

Self-healing method for fractured SiC amorphous nanowires

InventorID:

6037387 ⎘